Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-02-10
1985-10-15
Saba, William G.
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 29580, 148175, 148187, 148DIG85, 148DIG117, 156647, 156648, 156649, 357 50, 357 52, 357 55, H01L 21302, H01L 2176
Patent
active
045465371
ABSTRACT:
In a semiconductor device comprising at least one bipolar transistor and a VIP isolating layer which are formed in both an epitaxial layer and a semiconductor substrate, an impurity-introduced region having the same conductivity type as that of the semiconductor substrate is formed so as to surround the V-groove. A buried layer of the bipolar transistor comes into contact with the VIP isolating layer to divide the impurity-introduced region into two parts, one of which is combined with a base region and the other one of which serves as a channel stopper.
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Kawabe Yunosuke
Momma Yoshinobu
Fujitsu Limited
Saba William G.
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