Method for producing a semiconductor device including...

Details Method for producing a semiconductor device including... Method for producing a semiconductor device including...

2007-11-16

2011-10-18

Cao, Phat (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S684000, C257SE21606, C257SE23005, C257SE23008, C257SE23009, C257SE23194, C438S110000, C438S111000, C438S114000, C438S118000, C438S455000, C438S459000

Reexamination Certificate

active

08039313

ABSTRACT:
A semiconductor device and method for producing such a device is disclosed. One embodiment provides a semiconductor functional wafer having a first and second main surface. Component production processes are performed for producing a component functional region at the first main surface, wherein the component production processes produce an end state that is stable up to at least a first temperature. A carrier substrate is fitted to the first main surface. Access openings are produced to the first main surface. At least one further component production process is performed for producing patterned component functional regions at the first main surface of the functional wafer in the access openings. The end state produced in this process is stable up to a second temperature, which is less than the first temperature.

REFERENCES:
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patent: 5807783 (1998-09-01), Gaul et al.
patent: 5989492 (1999-11-01), Larsson
patent: 6306680 (2001-10-01), Fillion et al.
patent: 2003/0082847 (2003-05-01), Turner et al.
patent: 2005/0124140 (2005-06-01), Mulligan
patent: 19543893 (1997-02-01), None

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