Method for producing a semiconductor device

Details Method for producing a semiconductor device Method for producing a semiconductor device

1999-04-15

2000-05-30

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438127, 438469, 257778, H01L 2144

Patent

active

060690240

ABSTRACT:
The object of this invention is to provide a method whereby, during flip-chip connection using a thermosetting resin, it is possible to prevent the development of voids in the resin when the resin is hardened by pulse heating. The object is fulfilled by providing a method comprising heating a chip 4 to thereby harden a thermosetting resin 3 while applying a pressure to the chip 4 towards a substrate 1 to put a bump electrode 6 into contact with a wiring 2, wherein heating temperatures are adjusted appropriately according to:

REFERENCES:
patent: 5962925 (1999-10-01), Eifuku

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