Method for producing a resist structure

Details Method for producing a resist structure Method for producing a resist structure

1991-04-26

1993-11-16

RoDee, Christopher D.

Radiation imagery chemistry: process, composition, or product th

Color imaging process

Using identified radiation sensitive composition in the...

430326, 430328, 430330, 430323, 430313, 156643, G03C 556, G03F 736

Patent

active

052622835

ABSTRACT:
High resolution resist structures with steep edges are obtained using standard equipment, with high sensitivity, particularly in the deep UV range. A photoresist layer consisting of a polymer having anhydride groups and blocked imide- or phenolic hydroxyl groups and of a photoactive component which forms a strong acid during irradiation is first deposited on a substrate, followed by irradiation with a patterned image. The irradiated photoresist layer is then treated with a water-based or a water-alcohol-based solution of a polyfunctional amino- or hydroxy-siloxane, and is etched in an oxygen-containing plasma.

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Textbook of Polymer Science, F. Billmeyer, John Wiley & Sons, N.Y., (1984) pp. 471-475.
SPIE's 1990 Symposium on Microlithography, Mar. 4-9 1990, San Jose, Calif., U.S.A.; Seminar Vol., p. 101.

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