Method for producing a protective cover for a device

Details Method for producing a protective cover for a device Method for producing a protective cover for a device

2007-06-26

2007-06-26

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S417000, C029S856000, C029S858000, C029S883000, C073S159000, C073S204110, C073S204260, C156S268000, C156S345420, C156S922000, C257S701000, C257S704000, C427S249300, C427S258000, C427S402000, C427S404000, C438S110000, C438S125000, C438S455000, C438S458000, C438S976000

Reexamination Certificate

active

10821798

ABSTRACT:
In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.

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