Method for producing a protection for chip edges and system...

Details Method for producing a protection for chip edges and system... Method for producing a protection for chip edges and system...

2007-06-12

2007-06-12

Wilczewsld, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S789000, C438S126000

Reexamination Certificate

active

10890827

ABSTRACT:
The invention relates to a method for producing a protection for the chip edges of electronic components that are not provided with a housing, according to which semiconductor chips provided with a laterally open bonding channel are mounted on a substrate with a tape interposed between. The invention further relates to a system for protecting chip edges.

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Garti, Nissim, “New Non-Stick Epoxy-Silicon Water-Based Coatings, Part 1: Physical and Surface Properties,” Proceedings of the Fifth Inernational Zebra Mussel and Other Aquatic Nuisance Organisms Conference, Toronto, Canada, Feb. 1995.

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