Method for producing a printed wiring board

Details Method for producing a printed wiring board Method for producing a printed wiring board

2011-08-30

2011-08-30

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S844000, C029S851000

Reexamination Certificate

active

08006377

ABSTRACT:
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

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