Method for producing a power semiconductor module

Details Method for producing a power semiconductor module Method for producing a power semiconductor module

1995-11-13

1998-06-30

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438108, H01L 2160

Patent

active

057733201

ABSTRACT:
In the case of a method for producing a power semiconductor module (10), in which a plurality of submodules (12) are arranged on a common support (11), are interconnected by means of a multilayer laminate made of metal layers (13-15) and insulating layers (16, 17), which layers are layered alternately one above the other, and can be externally connected, reliable production of the laminate is achieved by virtue of the fact that in order to construct the laminate, the individual metal layers (13-15) and insulating layers (16, 17) are stacked one above the other, are aligned with one another and with respect to the support (11) by means of auxiliary alignment means (18, 19) and are interconnected in the aligned state by techniques such as welding, soldering or bonding.

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