Method for producing a plurality of semiconductor components

Details Method for producing a plurality of semiconductor components Method for producing a plurality of semiconductor components

1999-03-09

2000-02-15

Chaudhuri, Olik

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438 22, 438 33, 438458, 438465, H01L 21301

Patent

active

060252510

ABSTRACT:
A semiconductor component includes a semiconductor body having a front side, a rear side and at least one curved side surface. As viewed from outside the semiconductor body, the at least one curved side surface is convex adjacent the rear side and concave adjacent the front side. The rear side has a greater area than the front side. A method is also provided for producing a plurality of the semiconductor components.

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patent: 5349211 (1994-09-01), Kato
patent: 5429954 (1995-07-01), Gerner
patent: 5923053 (1999-07-01), Jakowetz

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