Method for producing a plastic material composite component, a p

Details Method for producing a plastic material composite component, a p Method for producing a plastic material composite component, a p

1997-02-26

1999-06-15

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438125, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

059131101

ABSTRACT:
A method for producing a plastic material composite component and a corresponding component are disclosed. The component is typically a smart card having a semiconductor chip embedded in plastic material. The component is provided with a contact area on an outer component surface. Electrical interconnection between the contact area and the chip is effected during injection molding the component.

REFERENCES:
patent: 5102828 (1992-04-01), Marchisi
patent: 5106785 (1992-04-01), Rauchmaul et al.
patent: 5200366 (1993-04-01), Yamada et al.
patent: 5244840 (1993-09-01), Kodai et al.
patent: 5728606 (1998-03-01), Laine et al.

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