Method for producing a package-type semiconductor assembly

Details Method for producing a package-type semiconductor assembly Method for producing a package-type semiconductor assembly

1991-10-04

1992-09-29

Lindsay, Robert L.

Glass manufacturing

Processes

With shaping of particulate material and subsequent fusing...

65 183, 65 184, 65 594, 65 595, 65139, 65140, 65144, 53140, 357 73, C03B 1909

Patent

active

051511185

ABSTRACT:
In production of a closed package-type semiconductor assembly provided with a built-in semiconductor element and conductive leads for connection to outside devices, a conductive island, the conductive leads and other accessories are united together by one stage moulding of molten glass. Simple process reduces the production cost greatly and no use of dusty ceramic components much raises functional reliability of the product.

REFERENCES:
patent: 3340347 (1967-09-01), Spiegler
patent: 3924246 (1975-12-01), Scherer
patent: 3996602 (1976-12-01), Goldberg et al.
patent: 4058821 (1977-11-01), Miyoshi et al.
patent: 4168960 (1979-09-01), Yoldas

Affiliated with

Also associated with

Rating

Method for producing a package-type semiconductor assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a package-type semiconductor assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a package-type semiconductor assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1966020