Method for producing a package for an electronic circuit and...

Details Method for producing a package for an electronic circuit and... Method for producing a package for an electronic circuit and...

2005-06-15

2008-12-23

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S048000, C257S690000, C257S693000, C257S724000, C257SE23001, C257SE23010, C257SE23144, C257SE21067, C257SE21521, C257SE21529, C324S071100, C324S071300, C324S071500, C324S076110

Reexamination Certificate

active

07468549

ABSTRACT:
The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region and an activation region arranged within the substrate. The activation region is generally in contact with the conduction region and is configured to change its electrical resistance when activation occurs.

REFERENCES:
patent: 4214918 (1980-07-01), Gat et al.
patent: 4888665 (1989-12-01), Smith
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6784551 (2004-08-01), Auburger et al.
patent: 6975517 (2005-12-01), Kwong et al.
patent: 101 44 462 (2002-11-01), None
German Patent Office Examination Report dated Feb. 16, 2005.
German Patent Office Examination Report dated Feb. 21, 2006.

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