Method for producing a non-single crystal semiconductor device

Fishing – trapping – and vermin destroying

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437 2, 437 4, 437108, H01L 2100, H01L 2102, H01L 2120

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052984559

ABSTRACT:
A MOS-FET transistor is produced on a substrate made of glass which has a non single crystal semiconductor film (2'). The average diameter of a crystal grain in said film is in the range between 0.5 times and 4 times of thickness of said film, and said average diameter is 250 .ANG.-8000 .ANG. , and said film thickness is 500 .ANG.-2000 .ANG.. The density of oxygen in the semiconductor film (2') is less than 2.times.10.sup.19 /cm.sup.3. A photo sensor having PIN structure is also produced on the substrate, to provide an image sensor for a facsimile transmitter together with the transistors. Said film (2') is produced by placing amorphous silicon film on the glass substrate through CVD process using disilane gas, and effecting solid phase growth to said amorphous silicon film by heating the substrate together with said film in nitrogen gas atmosphere. The film (2') thus produced is subject to implantation of dopant for providing a transistor. The film thus produced has high mobility which provides high speed operation of a transistor, and low threshold voltage of a transistor.

REFERENCES:
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patent: 4693759 (1987-09-01), Noguchi et al.
patent: 4814292 (1989-03-01), Sasaki et al.
Scheid et al., Japanese Journal Of Applied Physics, vol. 29, No. 11, Nov. 1990, Tokyo JP, pp. L2105-L2107.
Katoh, IEEE Transactions On Electron Devices, vol. 35, No. 7, Jul. 1988, New York US pp. 923-928.
Nakanishi et al., Extended Abstracts, vol. 90, No. 1, May 1990, Princeton, N.J. US pp. 489-490.
Sze, VLSI Technology, McGraw-Hill, 1988, pp. 233-235.
Kurihara, Completely Integrated Contact-Type Linear A-Si/A-SiC 23rd Meeting in 147th Committee of Heterojunction Image Sensor, Amorphous Material in Japan Science Promotion Association, Mar. 1989, pp. 7-12.

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