Method for producing a multilayer printed wiring board

Details Method for producing a multilayer printed wiring board Method for producing a multilayer printed wiring board

1988-09-13

1990-01-16

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29846, H01K 310

Patent

active

048934046

ABSTRACT:
A method for producing a multilayer printed wiring board by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) over a first insulating laminate (12), and second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern over through studs (15) and a second insulating laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.

REFERENCES:
patent: 4788766 (1988-12-01), Burger et al.
patent: 4799984 (1989-01-01), Relich
patent: 4830691 (1989-05-01), Kida et al.

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