Method for producing a multilayer printed-circuit board

Details Method for producing a multilayer printed-circuit board Method for producing a multilayer printed-circuit board

1985-12-09

1987-08-04

Larson, Lowell A.

Metal working

Method of mechanical manufacture

Electrical device making

156322, H05K 336

Patent

active

046836535

ABSTRACT:
A method for producing a multilayer printed-circuit board is disclosed, the method substantially comprises the steps of: printing an electrically conductive paste on one or both sides of a predetermined number of electrically insulated prepreg base plates to form thereon electrically conductive circuits; drying the circuit processed base plates; laminating and pressing the circuit processed base plates into a single laminated board; making holes in the single laminated board, the holes being extended through in the direction of the thickness of the board; and applying an electrical conductor to the inner faces of the holes to make electrically conductive the laminated circuits to each other within the single laminated board.

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patent: 4549043 (1985-10-01), Kalubowila et al.
patent: 4591220 (1986-05-01), Impey

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