Method for producing a multichip module and multichip module

Details Method for producing a multichip module and multichip module Method for producing a multichip module and multichip module

2007-05-01

2007-05-01

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C438S110000, C438S612000, C257S777000, C257S737000, C257SE21614

Reexamination Certificate

active

10952383

ABSTRACT:
A method for producing a multi-chip module having application of at least one contact elevation onto a substrate, application and patterning of a rewiring device onto the substrate and the at least one contact elevation with provision of a contact device on the at least one contact elevation, application of a semiconductor chip onto the substrate with electrical contact-connection of the rewiring device; application of an encapsulating device that is not electrically conductive onto the semiconductor chip, the substrate, the rewiring device and the at least one contact elevation, the contact device on the at least one contact elevation at least touching a first surface of the encapsulating device; and repetition at least once of at least the first two steps, the first surface of the encapsulating device serving as a substrate and the correspondingly produced rewiring device making electrical contact with the contact device of the at least one contact elevation of the underlying plane.

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