Method for producing a module with components stacked one...

Details Method for producing a module with components stacked one... Method for producing a module with components stacked one...

2011-08-09

2011-08-09

Lee, Eugene (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S786000, C257S777000, C257SE21499, C438S109000

Reexamination Certificate

active

07993969

ABSTRACT:
The invention relates to a method in which components (101, 102) are provided, movement elements (104) are in each case applied to surfaces of a number of the components (101), and the components (101, 102) are stacked, so that one or a plurality of the movement elements (104) are situated between adjacent components (101, 102) and the components (101, 102) are held in their position by connecting elements (103).

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“Package on Package (PoP)” by Amkor Technology Inc. (Packaging Subcontractor)—presented in Jan. 2006.
“ASE Proposal: Ball on Ball Stacking in Package on Package (PoP)”—presented on a JEDEC conference, Mar. 2006.

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