Method for producing a MISFET

Metal working – Method of mechanical manufacture – Assembling or joining

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29580, 29591, 148187, 156626, 156651, H01L 2122, H01L 21285

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active

044533055

ABSTRACT:
A method for producing a MISFET having a gate electrode formed at the base of a grooved recess. The grooved recess is formed with steep side-walls (e.g., be reactive ion etching, ion beam milling or by using an orientation dependent etchant) and gate and source and drain contacts are formed by the simultaneous deposition of conductive material (e.g., metal evaporated from a point source.) Steepness of the side-walls of the recess ensures separation of the conductive material, isolating the gate electrode from the remaining conductive material providing the source and drain contacts.
A silicon MISFET may be produced, using a diazine catalyzed ethylenediamine-pyrocatechol-water solution etchant, and exposing the (110) crystal plane face of the silicon to the etchant to form the recess.

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