Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2001-10-09
2003-07-01
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S840000, C156S275500, C156S275700, C228S180220
Reexamination Certificate
active
06584681
ABSTRACT:
BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION
The invention relates to a method for producing a microelectronic component of sandwich construction, and an inverter that includes the microelectronic component.
Such inverters can be used to convert direct current into alternating current, and are needed particularly for controlling motors. Power modules, of the kind used so far in inverters, as a rule include a substrate, on which a number of power chips as well as components for triggering, evaluating, protecting, and the like are disposed side by side. The substrate, for example, can be a filled plastic film, which is disposed on an aluminum base plate. A conductor track system, typically made of copper, is located on the plastic film. The connection among the individual components and between them and the conductor tracks is effected by so-called thick wire bonding. In so-called econopacks, bonding is not done to the conductor tracks but rather directly to terminal pins. Both in econopacks and in standard modules, terminal pins are needed for bonding, and they are complicated and expensive to make because they must be manufactured in a special production step with special tools.
Because all the system components are disposed side by side in the same plane, the known power modules are relatively large, and the connection paths spanned by bond wires are relatively long. In such an arrangement, a very poor power-inductance layout is obtained, and complicated technology is required. To prevent dynamic countercoupling, one additional control source is needed for the control terminal. Wire bonding is also a weak point in terms of alternating load stresses, which impairs the reliability of the power modules.
German Patent Application DE 34 06 528 A1 teaches the fixation of components when components are being soldered to conductor tracks. After soldering, the components should remain bonded to the conductor tracks as firmly as possible. To compensate for any possible mechanical stresses, compensation pieces made of molybdenum can optionally be provided.
U.S. Pat. No. 4,922,376 discloses the use of spring elements with components for contacting the components in a way that enables repair of a failed contact. If a contact fails, it can be repaired by loosening a screw connection and replacing the applicable spring element.
U.S. Pat. No. 5,203,075 discloses a method for connecting a first, flexible conductor track substrate to a second conductor track substrate. The first substrate has conductive balls, that are soldered to soldering points on the second substrate.
U.S. Pat. No. 4,855,867 discloses a flexible conductor track substrate onto which semiconductor chips are mounted that are electrically conductively connected by balls to a fixed circuit board.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide a method for producing a microelectronic component of sandwich construction that can be used particularly as a power module and that is simple and space-saving in design, and that provides an improved behavior in response to thermal mechanical stresses. The microelectronic component can be produced economically and simply, and it offers high flexibility in terms of the disposition of individual components. Furthermore, a lower-inductance makeup of the power and triggering part is assured.
With the foregoing and other objects in view there is provided, in accordance with the invention, a microelectronic component having a sandwich construction, comprising:
a first substrate having a first conductor track plane;
a plurality of semiconductor chips having first sides electrically connected to the first conductor track plane, and second sides opposite the first sides;
a second substrate having a second conductor track plane; and
an electrically conductive, flexible adhesive disposed between and electrically connecting the second conductor track plane and the second sides of the plurality of semiconductor chips.
In accordance with an added feature of the invention, an additional electrically conductive, flexible adhesive is disposed between the first conductor track plane and the first sides of the plurality of semiconductor chips. The additional electrically conductive, flexible adhesive provides the electrical connection of the first sides of the semiconductor chips to the first conductor track plane.
In accordance with an additional feature of the invention, balls are disposed in the additional electrically conductive, flexible adhesive.
In accordance with another feature of the invention, balls are disposed in the electrically conductive, flexible adhesive.
In accordance with a further feature of the invention, the first substrate and the second substrate are ceramic materials.
In accordance with a further added feature of the invention, the ceramic materials are selected from the group consisting of aluminum oxide and aluminum nitride.
In accordance with a further additional feature of the invention, the ceramic material is a thick film ceramic material and the first conductor track plane is a fired on conductor track plane.
In accordance with another added feature of the invention, the ceramic material is a thick film ceramic and the first conductor track plane is a direct copper bonded conductor track plane.
In accordance with another added feature of the invention, the ceramic material is a thick film ceramic and the first conductor track plane is an active metal brazed conductor track plane.
In accordance with another added feature of the invention, the first substrate is a thick film ceramic material and the first conductor track plane is a fired on conductor track plane.
In accordance with another added feature of the invention, the first conductor track plane is a material selected from the group consisting of copper and silver.
In accordance with another added feature of the invention, the first substrate is a thick film ceramic and the first conductor track plane is a direct copper bonded conductor track plane.
In accordance with another added feature of the invention, the first substrate is a thick film ceramic and the first conductor track plane is an active metal brazed conductor track plane.
In accordance with another added feature of the invention, the first substrate has a side opposite the first conductor track plane with a first metal layer.
In accordance with another added feature of the invention, a heat sink is disposed on the first metal layer.
In accordance with another added feature of the invention, the second substrate has a side opposite the second conductor track plane with a second metal layer.
In accordance with another added feature of the invention, a heat sink is disposed on the second metal layer.
In accordance with another added feature of the invention, the second substrate has holes formed therethrough.
In accordance with another added feature of the invention, the semiconductor chips are power chips.
In accordance with another added feature of the invention, electronic components selected from the group consisting of triggering, evaluation, and protective components are also included.
In accordance with another added feature of the invention, the electronic components are disposed on the second substrate.
In accordance with another added feature of the invention, the second substrate has holes formed therethrough, and the electronic components are electrically connected to the second conductor track plane through the holes.
In accordance with another added feature of the invention, the first substrate and the second substrate are clamped together.
In accordance with another added feature of the invention, the second substrate has at least two retaining openings formed therethrough, and the first substrate includes at least two retainers for releasably engaging the retaining openings.
In accordance with another added feature of the invention, the retainers are snap hooks.
In accordance with another added feature of the invention, the second substrate is separated into a plurality of individual regions.
In accordanc
Brückmann Manfred
Kaindl Michael
Lorenz Leo
Münzing Gerhard
Schwarzbauer Herbert
Arbes Carl J.
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
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