Method for producing a metallized pattern on a substrate

Details Method for producing a metallized pattern on a substrate Method for producing a metallized pattern on a substrate

1990-08-16

1992-02-25

Beck, Shrive

Coating processes

Coating by vapor, gas, or smoke

Metal coating

427 97, 427 99, 427124, 427237, 427238, 427296, B05D 512

Patent

active

050912186

ABSTRACT:
A method of producing a metallized pattern on a substrate includes the steps of providing a substrate having a high aspect ratio groove defining a desired metallization pattern and applying metallization to the substrate. The high aspect ratio groove is utilized to prevent metallization across the groove boundary thereby producing electrically isolated areas. The substrate can be a circuit board, hybrid module or other component carrying structure. Also the substrate can be a resonator or a stripline device in which the groove is used to electrially isolate a lead or wire extending from the substrate in the ground plane portion of the structure.

REFERENCES:
patent: 3999004 (1976-12-01), Chirino et al.
patent: 4258468 (1981-03-01), Balde
patent: 4532152 (1985-07-01), Elarde
patent: 4576685 (1986-03-01), Goffredo et al.
patent: 4597988 (1986-07-01), Kukamskis et al.
patent: 4651417 (1987-03-01), Schumacher et al.
patent: 4666739 (1987-05-01), Roubal
patent: 4751481 (1988-06-01), Guzik et al.

Affiliated with

Also associated with

Rating

Method for producing a metallized pattern on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a metallized pattern on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a metallized pattern on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1891791