Method for producing a metal lithographic plate

Chemistry: electrical and wave energy – Processes and products

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204 34, 204 381, 204 387, 204 40, 204 41, C25D 536, C25D 510

Patent

active

045855293

ABSTRACT:
A method for producing a metal substrate for a lithographic plate is provided herein by treating the substrate having the thickness in the range of 50 to 400 .mu.m. The said substrate is electrochemically, chemically or mechanically treated in order to provide an average surface roughness in the range of 0.1 to 3 .mu.m, followed by a surface treatment such as plating or chemical treatment, and then followed by a conventional hydrophilic treatment.

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