Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-06-24
2010-10-12
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000, C228S180220, C257S738000, C257S779000, C257S780000, C257S786000, C257SE23021
Reexamination Certificate
active
07811855
ABSTRACT:
A method for producing a matrix of electromagnetic radiation detectors made up of a plurality of elementary detection modules mounted on an interconnection substrate. The method includes depositing on the interconnection substrate a predefined number of quantities of solder or hybridization material, intended to constitute hybridization bumps for the elementary modules, in at least a first array for the nominal hybridization, and at least one second array, with the deposits of solder or hybridization material of the second array being lower in volume than those of the first array, depositing a liquid flux on the interconnection substrate, mounting the elementary modules to be hybridized on the interconnection substrate, and raising the temperature of a chamber in which the various elements to be hybridized are positioned until reaching at least the melting point of the solder or hybridization material to join the modules and interconnection substrate together by reflow effect.
REFERENCES:
patent: 5186383 (1993-02-01), Melton et al.
patent: 5552596 (1996-09-01), Ravetto et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6222277 (2001-04-01), Downes
patent: 6443351 (2002-09-01), Huang et al.
patent: 6650016 (2003-11-01), MacQuarrie et al.
patent: 7714452 (2010-05-01), Clevenger et al.
patent: 2003/0060035 (2003-03-01), Kimura et al.
patent: 2006/0202318 (2006-09-01), Satou et al.
patent: 2008/0003805 (2008-01-01), Pang et al.
patent: 2009/0321013 (2009-12-01), Pitault
patent: 30 42 085 (1981-06-01), None
patent: 197 38 399 (1999-03-01), None
patent: 0 665 594 (1995-08-01), None
patent: 2 062 963 (1981-05-01), None
Puttlitz Sr, K.J., “An Overview of Flip-Chip Replacement Technology on MLC Multichip Modules,” International Journal of Microcircuits and Electronic Packaging, The International Society for Hybrid Microelectronics, vol. 15, No. 3, Third Quarter 1992, Reston, VA, pp. 113-126.
Burr & Brown
Chambliss Alonzo
Societe Francaise de Detecteurs Infrarouges-Sofradir
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