Method for producing a layer with reduced mechanical stresses

Details Method for producing a layer with reduced mechanical stresses Method for producing a layer with reduced mechanical stresses

1994-11-23

1998-05-19

Tung, T.

Etching a substrate: processes

Nongaseous phase etching of substrate

1566541, 1566571, 216 96, 216 99, 427402, H01L 2102

Patent

active

057531340

ABSTRACT:
For producing a layer having reduced mechanical stresses, the layer is composed of at least two sub-layers that are matched to one another such that stress gradients in the two layers substantially compensate. The method is particularly employable in the manufacture of structures in surface micromechanics.

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