Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2001-07-30
2004-06-01
Zarneke, David A. (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S787000, C425S112000, C264S266000, C264S272150, C264S275000
Reexamination Certificate
active
06743663
ABSTRACT:
DESCRIPTION
The invention relates to a method for producing a hybrid frame or hybrid housing, in which a leadframe with soldering and/or bonding tags, made from a plated strip, after being placed into an injection mould is moulded with plastic to form a housing part of the hybrid frame or the hybrid housing, and to such a hybrid frame or such a hybrid housing.
Such a method is known. This method has the disadvantage, that upon punching of the soldering and/or bonding tags of the leadframe a buckling due to punching occurs. This buckling due to punching can cause in a disadvantageous manner the buckling of the whole surface of the leadframe, so that there is no plane and regular surface especially of the soldering and/or bonding tags. A further disadvantage of the known method consists in that the soldering or bonding tags of the leadframe, which project from the plastic material after moulding, are not held during moulding, but that it is only provided that the injection mould is formed in a way, that the bonding tags cannot move in the plastic injection mould during the moulding process.
It is therefore the object of the invention to further develop a method of the kind mentioned at the beginning, that the quality of the leadframe before moulding has relatively little influence on the quality of the soldering and/or bonding tags of the hybrid frame or hybrid housing to be formed.
This object is achieved according to the invention, in that the soldering and/or bonding tags of the leadframe are held in the injection moulding die at least during a part of the injection moulding process by means of a stamp.
The method according to the invention distinguishes itself in that by the measures according to the invention the position of the individual soldering and/or bonding tags of the leadframe is well reproducible and can be dimensioned within close limits. The holding down of the individual bonding surfaces by the stamp during the moulding process brings forth in an advantageous manner, that surface defects of the leadframe are compensated. Furthermore, it is advantageous, that by the holding of the bonding tags during the moulding process, the vibrational behaviour of the bonding tags is influenced in a positive manner. The invention has the further advantage, that in this manner the bonding surfaces are protected from moulding influences during the moulding process. The holding down of the soldering and/or bonding tags of the leadframe during the moulding process has the advantage, that in this manner position tolerances in a direction perpendicular to the surface of the leadframe are compensated, so that a good reproducibility in this z-axis is given as well.
An advantageous variant of the invention provides that as a stamp a forming stamp is used. This measure according to the invention has the advantage, that the soldering and/or bonding surfaces of the soldering and/or bonding tags which are produced in this way are of a high quality, especially if a polished forming stamp is used. Additionally, it is achieved in this way, that in the section of form-stamping at all positions of the soldering and/or bonding tags the same soldering and/or bonding conditions are given, so that the soldering and/or bonding process is not critical for the applicant and can therefore be dimensioned within wider limits.
Further advantageous variants of the invention are subject of the dependent claims.
REFERENCES:
patent: 4504427 (1985-03-01), Moyer
patent: 5118271 (1992-06-01), Baird et al.
patent: 5359761 (1994-11-01), Whitson et al.
patent: 642165 (1995-03-01), None
patent: 57 010955 (1982-05-01), None
Anderl Jorg
Bender Herbert
Lutte Winfried
Vogel Jurgen
Voll Norbert
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