Method for producing a force sensor

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S829000, C029S846000, C073S720000, C073S726000, C073S862627

Reexamination Certificate

active

08033009

ABSTRACT:
There is provided a method for producing a force sensor including: a force sensor chip; and an attenuator, in which the force sensor chip and the attenuator are joined at joint portions with a glass layer sandwiched therebetween. The method includes: a film forming step in which a glass film as the glass layer is formed on regions of the attenuator containing the joint portions or on regions of the force sensor chip containing the joint portions; and an anodic bonding step in which the force sensor chip and the attenuator are stacked as a stacked body in close contact with each other at the joint portions, and the glass film and the force sensor chip, or the glass film and the attenuator, are joined.

REFERENCES:
patent: 4454771 (1984-06-01), Shimazoe et al.
patent: 5459351 (1995-10-01), Bender
patent: 2006/0086190 (2006-04-01), Ohsato et al.
patent: 2007/0006668 (2007-01-01), Hirabayashi et al.
patent: 04/249727 (1992-09-01), None
patent: 06/296033 (1994-10-01), None
patent: 11-38038 (1999-02-01), None
patent: 2002/050771 (2002-02-01), None
patent: 2003-207405 (2003-07-01), None
patent: 2003-254843 (2003-09-01), None
patent: 2006-125873 (2006-05-01), None
patent: 2007-10379 (2007-01-01), None

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