Method for producing a data carrier

Details Method for producing a data carrier Method for producing a data carrier

1996-08-02

1998-12-22

Tsai, Jey

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438126, H01L 2144

Patent

active

058518541

ABSTRACT:
In a multilayer data carrier, an electronic module is provided in a corresponding opening or gap in at least one layer. For filling the remaining cavity after installation of the module in the gap, one provides on a layer adjacent the gap or on the layer containing the gap or directly on the electronic module a material preferably applied by printing technology and having a softening point lower than the softening point of the layer.

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