Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-10-30
2007-10-30
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S064000, C438S068000, C438S110000, C438S458000, C257SE21503, C257SE23119
Reexamination Certificate
active
10921087
ABSTRACT:
In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devices may be protected easily and at low cost from external influences and particularly from a casting material for casting the entire packaged device, which results when a diced chip is cast.
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Aigner Robert
Franosch Martin
Meckes Andreas
Oppermann Klaus-Guenter
Strasser Marc
Ghyka Alexander
Maginot Moore & Beck
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