Method for producing a contactless chip card using transfer...

Details Method for producing a contactless chip card using transfer... Method for producing a contactless chip card using transfer...

2005-06-21

2005-06-21

Lebentritt, Michael S. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S106000, C438S125000, C438S126000

Reexamination Certificate

active

06908786

ABSTRACT:
The invention concerns a manufacturing process for a contactless smart card (or ticket) which includes the following steps:a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting said support to heat treatment in order to bake and polymerize said conductive ink,connection of a chip14,provided with contacts, to the antenna12,lamination consisting in making the transfer paper sheet integral with a layer of plastic material16which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material,removal of the transfer paper sheet, andlamination of the card body onto the antenna support by welding at least one layer of plastic material (18, 20) by hot press molding on each side of the support.

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