Method for producing a circuit unit

Details Method for producing a circuit unit Method for producing a circuit unit

2005-01-11

2005-01-11

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S606000, C361S736000, C361S737000, C235S492000, C343S895000, C257S679000

Reexamination Certificate

active

06839963

ABSTRACT:
A circuit unit having a circuit unit comprising an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layers (9, 17) separated by insulating layers (11). To inter-connect the individual coil layer section (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

REFERENCES:
patent: 4960983 (1990-10-01), Inoue
patent: 4999742 (1991-03-01), Stampfli
patent: 5071509 (1991-12-01), Kano et al.
patent: 6176010 (2001-01-01), Droz
patent: 4416697 (1995-11-01), None
patent: 4428732 (1996-01-01), None
patent: 547563 (1992-12-01), None
patent: 2 621 147 (1989-03-01), None
patent: 06336096 (1994-06-01), None

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