Method for producing a circuit board

Details Method for producing a circuit board Method for producing a circuit board

2007-02-27

2007-02-27

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000

Reexamination Certificate

active

10502170

ABSTRACT:
After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.

REFERENCES:
patent: 4927742 (1990-05-01), Kohm
patent: 5374469 (1994-12-01), Hino et al.
patent: 5470647 (1995-11-01), Zimics et al.
patent: 5719090 (1998-02-01), Appelt et al.
patent: 5928970 (1999-07-01), Appelt et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 6163957 (2000-12-01), Jiang et al.
patent: 6326555 (2001-12-01), McCormack et al.
patent: 2003/0102153 (2003-06-01), Sugaya et al.
patent: 06-268345 (1994-09-01), None
patent: 09-148738 (1997-06-01), None
patent: 09-199829 (1997-07-01), None
patent: 1024637 (1998-09-01), None
patent: 11-207766 (1999-08-01), None
patent: 2001-155544 (2001-06-01), None
patent: 2001-266643 (2001-09-01), None
patent: 2001-308521 (2001-11-01), None
Japanese International Search Report for application No. PCT/JP03/017019 dated Mar. 2, 2004.

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