Method for producing a ceramic printed-circuit board

Etching a substrate: processes – Forming or treating electrical conductor article

Reexamination Certificate

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Details

C427S097100

Reexamination Certificate

active

07951301

ABSTRACT:
A method produces of a ceramic circuit board that has a ceramic substrate on a top side of the circuit board, solderable contact pads for components, and solderable contacts on an underside of the circuit board. The metallization for the solderable contact pads is produced by depositing a metal from a solution directly onto the ceramic substrate.

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Charles A Harper 'High Performance Printed Circuit Boards Advanced Ceramic Substrates for Microelectronic Systems, 2000 Mc-Graw Hill, USA, XP-002339276.
English translation of Examination Report dated Oct. 22, 2010 received in corresponding application JP 2007-517119.

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