Method for producing a carrier element for semiconductor chips

Details Method for producing a carrier element for semiconductor chips Method for producing a carrier element for semiconductor chips

1998-12-14

2000-07-18

Bryant, David P.

Metal working

Method of mechanical manufacture

Assembling or joining

174 524, 361737, 257679, 156252, 156219, B21D 3500

Patent

active

060889012

ABSTRACT:
A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

REFERENCES:
patent: 3537175 (1970-11-01), Clair et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4216577 (1980-08-01), Badet et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4701236 (1987-10-01), Vieilledent
patent: 4746392 (1988-05-01), Hoppe
patent: 5147982 (1992-09-01), Steffen
patent: 5295296 (1994-03-01), Hagiwara et al.
patent: 5376588 (1994-12-01), Pendse
patent: 5850690 (1998-12-01), Launay et al.

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