Method for producing a beam splitter molded part and optoelectro

Details Method for producing a beam splitter molded part and optoelectro Method for producing a beam splitter molded part and optoelectro

1999-03-30

2000-02-22

Phan, James

Optical: systems and elements

Single channel simultaneously to or from plural channels

By partial reflection at beam splitting or combining surface

359196, 359618, 359900, 359154, G02B 2710

Patent

active

06028708&

ABSTRACT:
A method is provided for producing at least one beam splitter molded part from transparent material in which a beam splitter layer is embedded. Two radiation-transparent wafers, of which one is provided with a beam splitter layer, are interconnected in such a way that the beam splitter layer lies between the two wafers. Subsequently, this wafer assembly is further processed to form individual prism ingots, for example by sawing them through into wafer strips and grinding or polishing lateral surfaces, or by profile sawing. An optoelectronic module for bidirectional optical data transmission uses the beam splitter molded part.

REFERENCES:
patent: 4732449 (1988-03-01), Fan

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