Method for processing wafer

Details Method for processing wafer Method for processing wafer

2006-10-03

2006-10-03

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

Reexamination Certificate

active

07115485

ABSTRACT:
To facilitate handling a wafer during processing even when the wafer is formed thin, a protective member is stuck through an adhesive agent to an outer-peripheral surplus region of a front surface of the wafer, the region being formed with no individual devices, and a back surface of the wafer is ground in a state where the whole front surface of the wafer is supported by the protective member. Since an outer periphery of the wafer is reinforced by the protective member, the wafer can be easily handled even after having been thinned by the grinding.

REFERENCES:
patent: 6888230 (2005-05-01), Ogino et al.
patent: 6905946 (2005-06-01), Grigg et al.
patent: 2003/0003688 (2003-01-01), Tandy et al.
patent: 2004/0023043 (2004-02-01), Ishikawa et al.
patent: 02137227 (1990-05-01), None
patent: 2003-209083 (2003-07-01), None
patent: 2004-022634 (2004-01-01), None

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