Method for processing thin wafers and solar cells of crystalline

Details Method for processing thin wafers and solar cells of crystalline Method for processing thin wafers and solar cells of crystalline

1995-05-01

1997-07-22

Picardat, Kevin

Fishing, trapping, and vermin destroying

437226, 437227, H01L 21461

Patent

active

056503636

ABSTRACT:
Thin semiconductor wafers and components manufactured therefrom, for instance solar cells of crystalline silicon, are subject to an increased breakage risk because of the brittle nature of the material and require a minimum thickness for the wafer in order to assure reliable handling. For improving the handling, a semiconductor wafer is provided surface-wide with a mechanical protective layer and this semiconductor wafer is subsequently subjected to a shaping treatment.

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patent: 5158645 (1992-10-01), Covert et al.
patent: 5393711 (1995-02-01), Biallas et al.
patent: 5400548 (1995-03-01), Huber et al.
patent: 5494549 (1996-02-01), Oki et al.
"Crystalline Silicon for Solar Cells," Martinelli, Solid State Phenomena, vol. 32-33 (1993) pp. 21-26.
"Growth of Stable Dislocation-Free 3-Grain Silicon Ingots for Thinner Slicing," Martinelli et al., Appl. Phys. Lett. vol. 62, No. 25, Jun. 21, 1993, pp. 3262-3263.

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