Method for processing substrate materials by means of plasma tre

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118715, 156345, 156643, 156646, 204192E, 204298, 250531, 427 38, H01L 21306

Patent

active

042921538

ABSTRACT:
A method for processing substrate materials by uniform plasma treatment, including the steps of mounting substrate materials onto a series of electrode plates arranged in parallel, alternately connecting the electrode plates to a pair of bus lines, applying a high-frequency power between the bus lines for producing plasma between the electrode plates, changing the feed points of the high-frequency power on the pair of bus lines so that the plasma treatment is effected substantially uniformly in the different spaces between the several electrode plates.

REFERENCES:
patent: 3450617 (1969-06-01), Hellund
patent: 3875068 (1975-04-01), Mitzel
patent: 3971684 (1976-07-01), Muto
patent: 3984301 (1976-10-01), Matsuzaki et al.
patent: 4178877 (1979-12-01), Kudo

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for processing substrate materials by means of plasma tre does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for processing substrate materials by means of plasma tre, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for processing substrate materials by means of plasma tre will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1232909

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.