Method for processing plastic packaged electronic devices

Details Method for processing plastic packaged electronic devices Method for processing plastic packaged electronic devices

1988-12-27

1990-08-28

Joyce, Harold

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

34 19, F26B 300

Patent

active

049514008

ABSTRACT:
The subject invention is a method for processing a plastic packaged electronic device with soldered leads. The solder has a critical temperature which if exceeded more than once results in its oxidation. The method comprises protecting the device with a carrier, and baking the device and carrier in a low pressure environment and at a temperature sufficiently high enough to drive off moisture previously absorbed by the plastic but lower than the critical temperature of the solder.

REFERENCES:
patent: 3815251 (1974-06-01), Van Gelder
patent: 4239485 (1980-12-01), Marshall
patent: 4612710 (1986-09-01), Fernwood et al.
patent: 4777520 (1988-10-01), Nambu et al.

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