Method for processing multiple semiconductor devices for test

Details Method for processing multiple semiconductor devices for test Method for processing multiple semiconductor devices for test

2005-06-14

2005-06-14

Flynn, Nathan J. (Department: 2826)

Semiconductor device manufacturing: process

With measuring or testing

C257S655000

Reexamination Certificate

active

06905891

ABSTRACT:
A packaged array (10) having a temporary substrate (20) is used to test a plurality of semiconductor devices (14). In one embodiment, the temporary substrate (20) is an adhesive substrate, such as tape. A support structure (18) may lie over the temporary substrate (20) or be within the temporary substrate (20). The plurality of semiconductor devices (14) lie within an array (16, 6,or8) and may be tested in parallel. One array or a multiple number of arrays may lie on the packaged array (10).

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patent: 2002/0016013 (2002-02-01), Iketani
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Dictionary of Science and Technology, Academic Press, p. 2125.

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