Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1996-10-24
1998-03-24
Niebling, John
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438 17, H01L 2166
Patent
active
057312303
ABSTRACT:
An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket
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Barnett Gregory A.
Hamren Steven L.
Layer William C.
Nevill Leland R.
Micro)n Technology, Inc.
Niebling John
Turner Kevin F.
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