Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Patent
1999-01-07
2000-05-09
El-Arini, Zeinab
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
134 9, 134 32, 134 33, 134902, 15 77, 15 881, 15 882, 15 883, B08B 302, B08B 104, B08B 1100
Patent
active
060598891
ABSTRACT:
A method for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.
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Dyson, Jr. William
Jensen Alan J.
Mertke Norman A.
Paino Patrick
Ryle Lynn
El-Arini Zeinab
OnTrak Systems, Inc.
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