Method for processing a semiconductor wafer

Details Method for processing a semiconductor wafer Method for processing a semiconductor wafer

1992-09-11

1994-05-24

Wilczewski, Mary

Fishing, trapping, and vermin destroying

437235, 437239, 148DIG118, H01L 21283

Patent

active

053148460

ABSTRACT:
An apparatus and method for growing semiconductor quality oxide thermal layers on semiconductor wafers fast enough to be economically feasible as a single wafer process system. Process speed is insured by high pressure and high temperature. For example, if the pressure is about 100 atmospheres (1,500 psi) and at a temperature of 900.degree. C., approximately 2.66 minutes are required to grow a 5,000.ANG. oxide layer in a steam environment. The system can reach these operating conditions from ambient in approximately 30 seconds and depressurization and cool down require approximately 60 to 90 seconds. The apparatus includes a processing chamber to be pressurized with an oxidant, such as high pressure steam. The process chamber is contained in a pressure vessel adapted to be pressurized with an inert gas, such as nitrogen, to a high pressure. A pressure equalizing scheme is used to keep the fluid pressure of the process chamber and the pressure of the fluid pressure vessel substantially the same. The pressure equalization permits the use of thin walls for defining the process chamber.

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