Method for processing a material by means of a laser...

Details Method for processing a material by means of a laser... Method for processing a material by means of a laser...

2006-11-09

2010-12-07

Carter, Aaron W (Department: 2624)

Image analysis

Applications

Biomedical applications

C382S141000, C382S203000, C219S121600, C348S067000

Reexamination Certificate

active

07848552

ABSTRACT:
The present invention relates to processing a material. The material lies on a carrier and is cut by irradiation with a laser beam, or an object of the material is catapulted from the carrier to a collection device by means of the laser beam. An image of the material on the carrier is generated. The image is evaluated automatically in order to identify structures in it. A region of the image is automatically selected on the basis of the identified structures. The selected region is then used for automatically cutting the material and/or catapulting the object, or serves as a working region in which the material is cut or from which the object is catapulted. Parallel sections through the material may in particular be employed.

REFERENCES:
patent: 4523278 (1985-06-01), Reinhardt et al.
patent: 4682891 (1987-07-01), de Macario et al.
patent: 4918611 (1990-04-01), Shyu et al.
patent: 5031099 (1991-07-01), Kettler
patent: 5568384 (1996-10-01), Robb et al.
patent: 5790692 (1998-08-01), Price et al.
patent: 6118582 (2000-09-01), Del Buono
patent: 6381353 (2002-04-01), Weiss
patent: 6528279 (2003-03-01), Yokota et al.
patent: 6594586 (2003-07-01), Song et al.
patent: 6690470 (2004-02-01), Baer et al.
patent: 6713264 (2004-03-01), Luttermann et al.
patent: 6867038 (2005-03-01), Liotta et al.
patent: 6991714 (2006-01-01), Gauss et al.
patent: 2001/0033414 (2001-10-01), Yahiro
patent: 2002/0048747 (2002-04-01), Ganser
patent: 2002/0081014 (2002-06-01), Ravkin
patent: 2002/0090122 (2002-07-01), Baer et al.
patent: 2002/0101654 (2002-08-01), Pfeifer
patent: 2003/0203461 (2003-10-01), Bova
patent: 2004/0023320 (2004-02-01), Steiner et al.
patent: 2004/0026630 (2004-02-01), Mohun et al.
patent: 2004/0071320 (2004-04-01), Pfister
patent: 2004/0093166 (2004-05-01), Kil
patent: 2005/0163659 (2005-07-01), Duveneck et al.
patent: 2007/0153369 (2007-07-01), Schütze et al.
patent: 2008/0285795 (2008-11-01), Maddison et al.
patent: 82 20 792 (1982-10-01), None
patent: 38 36 716 (1990-05-01), None
patent: 42 11 904 (1992-11-01), None
patent: 196 16 216 (1997-10-01), None
patent: 196 29 141 (1998-04-01), None
patent: 198 04 800 (1999-08-01), None
patent: 198 15 400 (1999-10-01), None
patent: 695 10 925 (2000-02-01), None
patent: 100 37 203 (2002-04-01), None
patent: 102 29 880 (2004-01-01), None
patent: 10 2004 051 508 (2005-06-01), None
patent: 10 2004 023 262.8 (2005-12-01), None
patent: 0 014 857 (1980-09-01), None
patent: 0 100 475 (1984-02-01), None
patent: WO 90/10273 (1990-09-01), None
patent: WO 96/09594 (1996-03-01), None
patent: WO 97/29355 (1997-08-01), None
patent: WO 01/33190 (2001-05-01), None
patent: WO 01/73398 (2001-10-01), None
patent: WO/02/10834 (2002-02-01), None
patent: WO 02/48949 (2002-06-01), None
patent: WO 02/084368 (2002-10-01), None
patent: WO 02/093450 (2002-11-01), None
patent: WO 03/036266 (2003-05-01), None
patent: WO 03/090169 (2003-10-01), None
patent: WO 03/096018 (2003-11-01), None
patent: WO 03/105675 (2003-12-01), None
patent: WO 2004/025569 (2004-03-01), None
patent: WO 2005/040762 (2005-05-01), None
patent: WO 2005/114135 (2005-12-01), None
Bio Spectrum vol. 10, No. 3 (2004), New Application Fields of Laser Microdissection in Research and Practice, Renate Burgemeister pp. 332-334.
Brochure of P.A.L.M. (2003): Palm MicroBeam IP-MS + Metafax P.

Affiliated with

Also associated with

Rating

Method for processing a material by means of a laser... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for processing a material by means of a laser..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for processing a material by means of a laser... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4223789