Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
Reexamination Certificate
2009-03-12
2010-10-12
Smoot, Stephen W (Department: 2813)
Semiconductor device manufacturing: process
Having magnetic or ferroelectric component
C438S125000, C257SE21511, C029S830000
Reexamination Certificate
active
07811835
ABSTRACT:
The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes5and the insulating film6are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes5and the insulating film6of a semiconductor chip1aare planarized in continuously flat with a hard cutting tool, as of diamond or others.
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Imaizumi Nobuhiro
Ishizuki Yoshikatsu
Mizukoshi Masataka
Fujitsu Limited
Fujitsu Patent Center
Smoot Stephen W
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