Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1996-02-26
1998-06-30
Nguyen, Vinh P.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324754, G01R 104
Patent
active
057739870
ABSTRACT:
A process for probing a semiconductor wafer involves bringing the bond pads (63) of a semiconductor die (114) into contact with probes (122) of a probe card (120) by moving a probe chuck (110) in the Z-direction. Initial contact is made with "zero-overdrive." The probe chuck is then moved in a small amount in the Z-direction to induce a pressure in the probe. Scrubbing of the probes against the pads is then performed by moving the probe chuck in the X and Y directions. During movement in the X and Y directions, the pressured induced in the probe is released, causing the probe to begin to break through an oxide layer (62) of the bond pad. If the oxide layer is not completely broken, the movement of the probe chuck in the Z and then X & Y directions is repeated until electrical contact between the probes and the bond pads is made.
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Abel Jeffrey S.
Goddard Patricia S.
Motorola Inc.
Nguyen Vinh P.
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