Method for printing solder paste

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437182, 437203, 118210, 118213, 22818022, H01L 2148

Patent

active

056935595

ABSTRACT:
A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for printing solder paste does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for printing solder paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for printing solder paste will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-800897

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.