Method for printing on synthetic resin molded body and headphone

Details Method for printing on synthetic resin molded body and headphone Method for printing on synthetic resin molded body and headphone

1991-07-23

1993-07-13

Kuhns, Allan R.

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

264 51, 264 53, 264132, 264245, B29C 6722

Patent

active

052270998

ABSTRACT:
A method for printing a letter, character or a figure on an inner ear type headphone, which is a molded body of a thermoplastic synthetic resin, by irradiating the surface with a laser light, and a headphone housing on which the letter etc. has been printed by the above method. The printing is performed by irradiating the surface of the synthetic resin molded body with a laser light for expanding any moisture or air contained in the molded body for foaming the surface. Printing is achieved in the form of foamed regions of the synthetic resin and hence is clear and superior in abrasion resistance and durability.

REFERENCES:
patent: 3368014 (1968-02-01), Tijunelis
patent: 3627858 (1971-12-01), Parts et al.
patent: 3949028 (1976-04-01), Murakami et al.
patent: 4032691 (1977-06-01), Kido et al.
patent: 4092518 (1978-05-01), Merard
patent: 4096218 (1978-06-01), Yasuike et al.
patent: 4260575 (1981-04-01), Thew et al.
patent: 4407768 (1983-10-01), Garcia et al.
patent: 4507346 (1985-03-01), Maurer et al.
patent: 4559367 (1985-12-01), Hurps et al.
patent: 4710330 (1987-12-01), Lewandowski et al.

Affiliated with

Also associated with

Rating

Method for printing on synthetic resin molded body and headphone does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for printing on synthetic resin molded body and headphone, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for printing on synthetic resin molded body and headphone will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2309941