Method for printed circuit board pattern making using selectivel

Details Method for printed circuit board pattern making using selectivel Method for printed circuit board pattern making using selectivel

1990-08-24

1991-05-21

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

427 98, 427304, 427305, C25D 502, B05D 0304, B05D 510

Patent

active

050172719

ABSTRACT:
The present invention provides a method for producing high density electronic circuit boards comprising the steps of depositing a layer of a first metal upon a layer of foil to produce a composite then attaching the composite to an insulative support to produce a laminate. The layer of foil is then removed from the layer of first metal. Photoresist is then applied to the layer of first metal, exposed and developed. During the development of the photoresist portions of the photoresist are removed from the layer of first metal. A layer of third metal is then plated upon the portions of the layer of first metal that are not covered by the photoresist. All remaining photoresist and the portions of the layer of first metal which are not covered by the third metal are then removed producing a finished fine-line pattern having conductive and insulative areas. The finished fine-line pattern may then be utilized to produce a circuit board.

REFERENCES:
patent: 3469982 (1969-09-01), Celeste
patent: 3857681 (1974-12-01), Yates et al.
patent: 3981691 (1976-09-01), Cunro
patent: 4049481 (1977-09-01), Morisaki
patent: 4082620 (1978-04-01), Skurkiss
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4863808 (1989-09-01), Sallo
"Soviets Offer PCB Technology", Electronic Buyers News, Sep. 3, 1990, p. 2.
"Copper Foil for Printed Wiring Applications", IPC Standard 1981, May 1981.
Bupp, et al., "High-Density Board Fabrication Techniques", IBM J. Res. Dev., vol. 26, No. 3, May 1982.
Bucci et al., "Copper Foil Technology", PC FAB, Jul. 1986.

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