Cleaning and liquid contact with solids – Processes – Miscellaneous
Patent
1986-06-24
1988-04-26
Sneed, Helen M. S.
Cleaning and liquid contact with solids
Processes
Miscellaneous
134 18, 134 26, 134 30, 134 40, 427 8, 73150R, 374 53, B08B 700, B08B 704, B08B 3000
Patent
active
047402474
ABSTRACT:
Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.
REFERENCES:
patent: 3650669 (1972-03-01), Osborn et al.
patent: 3715293 (1973-02-01), Sandre et al.
patent: 3933674 (1976-01-01), Farnsworth
patent: 3989610 (1976-11-01), Tsukada et al.
patent: 4064287 (1977-12-01), Lisson et al.
patent: 4246147 (1981-01-01), Bakos et al.
patent: 4276186 (1981-06-01), Bakos et al.
patent: 4297729 (1981-10-01), Bakos et al.
patent: 4369287 (1983-01-01), Hutchinson et al.
patent: 4373974 (1983-02-01), Barajas
patent: 4434084 (1984-02-01), Hicks et al.
patent: 4461652 (1984-07-01), Richmond
patent: 4511488 (1985-04-01), Matta
patent: 4569695 (1986-02-01), Yamashita et al.
patent: 4589926 (1986-05-01), Holmstrand
patent: 4620937 (1986-11-01), Dellutri
Hayes Michael E.
Hood Craig C.
Miller Ronald E.
Sharpe Robert
Petroleum Fermentations N.V.
Sneed Helen M. S.
Wright William G.
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