Method for prevention of fouling and corrosion utilizing technet

Details Method for prevention of fouling and corrosion utilizing technet Method for prevention of fouling and corrosion utilizing technet

1977-01-05

1978-10-31

Tung, T.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204196, 204 455, 114222, 427 5, C23F 1300, C25D 354, B63B 5900

Patent

active

041233387

ABSTRACT:
The growth of organisms on the surface of a substrate in contact with water is prevented, while simultaneously preventing corrosion of such substrates. This is accomplished by a method wherein technetium metal is imbedded in, or cast, electroplated or sputtered onto the substrate, or is otherwise included in the surface layer of the substrate being used on or under water.

REFERENCES:
patent: 3374157 (1968-03-01), Box
Voltz et al., "J. Electrochem. Soc.", Feb. 1967, pp. 128-131.
Box, "Nuclear Applications", vol. 1/2, Apr. 1965, pp. 155-159.
"JACS", vol. 77, pp. 2658 and 2659 (1955).

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