Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Reexamination Certificate
2006-11-01
2009-12-22
Nguyen, Kahnh (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
C156S350000, C156S351000, C156S064000, C156S378000, C156S235000
Reexamination Certificate
active
07635014
ABSTRACT:
The substrate is placed over a pressure detection film, the element group is placed selectively over the substrate so that a conductive film functioning as an antenna formed over the substrate and a conductive film functioning as a bump formed over the element group overlap each other, the substrate and the element group are pressure-bonded to each other by applying pressure to the substrate and the element group so that the conductive film formed over the substrate and the conductive film functioning as a bump formed over the element group are electrically connected to each other, a value and distribution of pressure applied to the element group at the time of the pressure bonding are detected by the pressure detection film, and the pressure applied at the time of the pressure bonding is controlled, based on the detected pressure value and pressure distribution.
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Kusumoto Naoto
Takahashi Hidekazu
Cook Alex Ltd.
Nguyen Kahnh
Patel Vishal I
Semiconductor Energy Laboratory Co,. Ltd.
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